Avoid over-specifying epitaxy layers to reduce costs.

Over-specifying the epitaxy layers in a wafer structure dramatically increases costs. Prof. Richard Hogg and Dr. Neil Gerrard’s article, “Specifying Epitaxial Wafers for Optimal Cost and Performance”, looks at some common examples of over-specifying epitaxy which could be avoided, such as:

1. Definition of alloy compositions which exceed that of the characterisation process.
2. Specification of doping level tolerance that exceeds what can be assured with standard equipment in the laboratory.
3. Use of ternary layers where a binary would be sufficient. For example, is an InAs₀.₀₁ P₀.₉₉ layer really needed, or would a standard
4. InP layer be an acceptable substitute?

Use of “exotic alloys” that will need extra work to assure. If a very specific material is required, it can often be produced, but the resulting assurance takes time, effort, and cost.

Let the experts at III-V Epi help with wafer specification to ensure it is optimised for fabrication.

Read the full article here.