Mis-specifying, under-specifying and over-specifying the epitaxy layers in a wafer structure dramatically affect costs.
Prof. Richard Hogg and Dr. Neil Gerrard’s article, “Specifying Epitaxial Wafers for Optimal Cost and Performance”, looks at the pitfalls and best practice in the specification process to avoid unnecessary costs, without compromising device performance.
Mis-specifying is when layers of epitaxy are requested that cannot be produced. Under-specifying is when the tolerance of an epitaxy layer is not constrained enough, impacting the parametric and repeatability performance of the resulting semiconductor device. Over-specifying is when a tolerance is requested that significantly increases production costs without benefitting device performance.
Speak to the III-V Epi team to ensure your wafer design is optimised for fabrication.